BFI-100系列

BFI(Bright Field Inspection) 明场缺陷检测系统

BFI(Bright Field Inspection) Wafer Inspection System

BFI-100系列

简介

n   宽波段（紫外光和可见光）光学图形晶圆检测系统

n   高光学分辨率，高检测灵敏度，高产率

Introduction

n   Broadband (UV & Visible) opticalpattern wafer inspection system

n   High optical resolution, highinspection sensitivity, high throughput

技术

n   LSP (Laser Sustained Plasma) 光源

n   多种照明模式

n   高通量数据处理

n   高速自动对焦系统 （Auto Focus）

n   高速和高精密运动控制工件台

Technologies

n   LSP (Laser Sustained Plasma) lightsource

n   Multiple imaging modes

n   High speed data processing

n   High speed AF （Auto Focus）system

n   High speed & precision motioncontrol stage system

应用

n   先进逻辑和存储图形晶圆的工程分析和产线监控

n   制程监控

•    ADI (After Develop Inspection)

•    AEI (After Etch Inspection)

•    CMP (Chemical Mechanical Polishing)

n   工艺窗口的验证

Application

n   Engineering analysis and productionline monitoring for advanced Logic and Memory pattern wafer

n   Process Monitoring

•      ADI (After Develop Inspection)

•      AEI (After Etch Inspection)

•      CMP (Chemical Mechanical Polishing)

n   Process Window Qualification